Category | Part No. | MFR | Packaging |
| ADC | AD9680BCPZ-1250 | ADI | LFCSP64 |
| ADC | AD9689BBPZ-2000 | ADI | BGA196 |
| ADC | ADC12D1800RFIUT | TI | BGA292 |
| ADC | ADS54J69IRMP | TI | VQFN-72 |
| FPGA | XC7K325T-2FFG900I | XILINX | BGA900 |
| FPGA | XC6SLX9-L1CSG324I | XILINX | BGA324 |
| FPGA | XCZU19EG-2FFVC1760I | XILINX | BGA1760 |
| FPGA | EP4CE115F29I7N | ALTERA | BGA780 |
| FPGA | EP4CE6E22C8N | ALTERA | TQFP144 |
| Microwave radio frequency | CGHV96100F2 | CREE | N/A |
| Microwave radio frequency | TGA2597-SM | QORVO | N/A |
| Microwave radio frequency | LFCN-3800+ | MINI | N/A |
2018
09-11
2018
09-11
At the beginning of this year, NXP, the leader of automotive electronic chips, opened this year's global microcontroller chip to increase the front gun, announcing that it will increase the price of m
Topology Industry Research Institute pointed out that compared with the current mainstream silicon wafers (Si), the third-generation semiconductor materials SiC and GaN in addition to the characterist
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